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Microstrip components

Microstrip components

  

service frequency

(GHz)

tape width

(MHz)

Loss (dB) MAX

Isolation (dB)

MIN

standing

wave

MAX

model

series

pass through

Power/reflectance

(W)

Shape size L*W*H

(mm)

working

temperature

℃)

linkage

way

★5.0~13.0

4000

0.5/1

15/28

1.2

BKHZW1103-**

20/10

11*10.5*3.5

-55~85

Silkbonding

FULL

0.8/1.6

12/25

1.3

20/10

11*10.5*3.5

-55~85

Silkbonding

8.0~12.0

2000

0.5/1

15/28

1.2

BKHZW1107-**

20/2

9*10.4*4

-55~85

Silkbonding

FULL

0.6/1.2

12/25

1.2

20/2

9*10.4*4

-55~85

Silkbonding

14.0~18.0

2000

0.5/1

18/30

1.2

BKHZW1108-**

10/1

8*7*3.5

-55~85

Silkbonding

FULL

0.6/1.2

16/30

1.2

10/1

8*7*3.5

-55~85

Silkbonding

14.0~18.0

2000

0.5/1

16/30

1.2

BKHZW1106-**

10/1

7*8*3.5

-55~85

Silkbonding

FULL

0.6/1.2

16/30

1.2

10/1

7*8*3.5

-55~85

Silkbonding

25.0~27.0

1000

0.8/1.4

15/28

1.4

BKHZW1113-**

5/1

4.5*6.5*3

-55~85

Silkbonding

FULL

1/1.6

13/25

1.5

BKHZW1113-**

5/1

4.5*6.5*3

-55~85

Silkbonding

Note: The above index data are typical values , and the test temperature is normal temperature (25℃) . The "★ " 2024 pre-research project is in the development stage .

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